eda1 - RoViSP 2009 : International Conference on Robotics, Vision, Signal Processing and Power Applications
Home
Committee
CALL FOR PAPER
Biography of Keynote Speaker
AUTHOR'S KIT
REGISTRATION(LATEST INFO!)

ACCEPTED PAPERS(LATEST INFO!)
TECHNICAL PROGRAM(LATEST INFO!)

Accommodation (LATEST INFO!)
Transportation(LATEST INFO!)
Visa
Venue and Travel Info
Gallery
Contact

Important Dates
31 May 09: Submission of Full Paper (Extended)
15 July 09: Notification of acceptance
15 July 09: REGISTRATION OPENS
15 August 09: Last Date of Early Bird Registration with Payment
3 Sep. 09: Final Date of Registration with Payment! (Extended)
Registration still opens until 19 Oct 2009 BUT the registration fee imposed will be RM1500 excluding the accomodation
19-20 Dec. 09: Conference


Technical Program




RETURN to Day 1 main schedule, Saturday 19 December 2009

SATURDAY, 19 December 2009
SLOT 1: Electronic Design and Applications 1
EDA 1

TIME: 1500-1630
VENUE: Room 5
Chairperson: Norihan Abd Hamid, UTeM, Malaysia.
1500
-
1515
p1006
A Shallower Junction Formation by Dopant Diffusion
Fauziyah Salehuddin, Norihan Abdul Hamid, Niza Idris, Ibrahim Ahmad
UTeM, Malaysia

1515
-
1530
p1048
Electronically Tunable Current-mode Quadrature Oscillator
Montree Kumngern and Jirasak Chanwuthitum
KMITL, Thailand

1530
-
1545
p1049
Current-Mode Square-Rooting Circuit
Montree Kumngern and Kobchai Dejhan
KMITL, Thaliand

1545
-
1600
p1051
Simple Voltage-Controlled Grounded Resistor
Montree Kumngern and Somyot Junnapiya
KMITL, Thailand

1600
-
1615
p1085
Development of the OQPSK Modulator for Zigbee Standard on FPGA
Rafidah Ahmad, Othman Sidek, Shukri Korakkottil Kunhi Mohd
CEDEC, USM, Malaysia.

1600
-
1615
p1113
Portable Qibla and Prayer Times Finder using GPS, Digital Compass and Nokia Color LCD
M. Z. Ibrahim, M. Z. Norashikin and M. H. Ariff
UMP, Malaysia.


RETURN to main Day 1 schedule, Saturday 19 December 2009
Organized By:


Universiti Sains Malaysia


Sponsored By:


The Institution of Engineers, Malaysia


The Institution of Engineering and Technology, Malaysia Network



IEEE Malaysia PEL/IE/IA Joint Chapter
RoViSP 2009,
School of Electrical & Electronic
Engineering, Engineering Campus, Universiti Sains Malaysia,
Seri Ampangan, 14300 Nibong Tebal,
Penang, Malaysia.
Tel:+604 5996011;
Fax:+604 5941023;
Email: rovisp09@rovisp.org