Technical Program Day 2 - RoViSP 2009 : International Conference on Robotics, Vision, Signal Processing and Power Applications
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Important Dates
31 May 09: Submission of Full Paper (Extended)
15 July 09: Notification of acceptance
15 July 09: REGISTRATION OPENS
15 August 09: Last Date of Early Bird Registration with Payment
3 Sep. 09: Final Date of Registration with Payment! (Extended)
Registration still opens until 19 Oct 2009 BUT the registration fee imposed will be RM1500 excluding the accomodation
19-20 Dec. 09: Conference


Technical Program




Go to Day 1, Saturday 19 December 2009
Sunday, 20 December 2009
0900
-
1030
Technical Sessions - SUNDAY - SLOT 3
Room 1  Room 2  Room 3  Room 4  Room 5 
CIS4
Computer Vision, Image and Signal Processing 4
SAC3
Software Engineering, Artificial Intelligence and Computer Application 3
CRM3
Control, Robotics and Mechatronics 3
TSA3
Telecommunication, Systems and Applications 3
EDA2
Electronics Design and Applications 2
1030-1045 Tea Break
1045
-
1145

Keynote Speech 4
Multi-Robot Systems: Some Issues in Communications and Cooperation
by Prof. Shamsudin H. M. Amin,
Centre for Artificial Intelligence and Robotics, Universiti Teknologi Malaysia.

1145
-
1300
Technical Sessions - SUNDAY - SLOT 4
Room 1  Room 2  Room 3  Room 4  Room 5 
CIS5
Computer Vision, Image and Signal Processing 5
PSI1
Power Systems and Industrial Application 1
CRM4
Control, Robotics and Mechatronics 4
TSA4
Telecommunication, Systems and Applications 4
EDA3
Electronics Design and Applications 3
1300-1400 Lunch
1400
-
1530
Technical Sessions - SUNDAY - SLOT 5
Room 1  Room 2  Room 3  Room 4  Room 5 
CIS6
Computer Vision, Image and Signal Processing 6
PSI2
Power Systems and Industrial Application 2
CRM5
Control, Robotics and Mechatronics 5
TSA5
Telecommunication, Systems and Applications 5
Go to Day 1, Saturday 19 December 2009

Organized By:


Universiti Sains Malaysia


Sponsored By:


The Institution of Engineers, Malaysia


The Institution of Engineering and Technology, Malaysia Network



IEEE Malaysia PEL/IE/IA Joint Chapter
RoViSP 2009,
School of Electrical & Electronic
Engineering, Engineering Campus, Universiti Sains Malaysia,
Seri Ampangan, 14300 Nibong Tebal,
Penang, Malaysia.
Tel:+604 5996011;
Fax:+604 5941023;
Email: rovisp09@rovisp.org